Intel's Foundry division nears major deals. CFO David Zinsner announced Wednesday that Intel is close to closing billion-dollar-per-year contracts for advanced packaging technology, a critical capability in the AI-driven semiconductor market. The company's EMIB and Foveros packaging solutions enable multi-die processors essential for complex GPU accelerators. Meanwhile, CEO Lip-Bu Tan has reconsidered Intel's 18A process strategy, now planning external customer offerings alongside the previously planned 14A node. Intel's 18A-P delivers eight percent higher performance per watt compared to TSMC's 2nm, positioning it competitively. These developments signal potential revenue growth for Intel's struggling Foundry Division, though execution remains critical given the company's historical delivery challenges.